Monday, May 25, 2015
Tuesday, May 19, 2015
ZERODUR
ZERODUR
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ZERODUR® is a glass ceramic characterized by a phase of evenly distributed nano-crystals within a residual glass phase. It contains around 75 weight percent crystalline phase with a high quartz structure. The crystal structure has a negative linear thermal expansion, while the other glass phase has a positive linear thermal expansion. The material is adjusted in a way that the positive thermal expansion of the glass phase and the negative thermal expansion of crystal structure effectively neutralize each other. The crystals are typically only 50 nm in diameter, and ZERODUR appears reasonably transparent because the refractive indices of the two phases are almost identical. The most important properties of zerodur are:
Figure 1&2 and table 1 give an overview of ZERODUR’s properties.
Low Expansion Materials :
ZERODUR® is a registered trademark of Schott Glass Technologies.
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Friday, May 15, 2015
DAD321 Porous Ceramic Chuck Table
Chuck Table for DAD321 Dicing Saw
www.chuck-table.com
All rights reserved by Werlchem LLC, California
www.chuck-table.com
All rights reserved by Werlchem LLC, California
Wednesday, May 13, 2015
Wafer lapping ,polishing ,thinning ceramic plate
Wafer lapping ,polishing ,thinning ceramic plate
Key Features
· Material
99.8% Alumina,high density,high hardness and good thermal conductitivity
· Tolerance
High flatness,parallelism ,roughness and micro constructure
· Efficiency
Contract manufacturing on associated variety of shapes,sizes and retain regular sizes in stock
· Cost
Total cost ownership commitment with swift responding,consistent cost reduction and overal design and development
Friday, May 8, 2015
Thin Film or Wafer Carriers
Thin Film or Wafer Carriers
Sapphire material is now widely
used in optical and semiconductor industry, with hardness second only to
diamond and chemical and scratch resistance and thermal stability ,it is
superior to other materials such as quartz.
Sapphire carrier are used to hold
and transport thin film processing of silicon,GaAs other semiconductor wafers
and flexible substrates.
All thin substrate carriers are
ultra flat and can be supplied with or without custom perforated holes,other
option of porous ceramic is also our expertise.
Current sizes are available typically from 2" to
12" dia with flatness and parallelism of 0.002-0.005mm, large size till 20
inches is also successfully prototyped.
Thursday, May 7, 2015
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