Wednesday, May 13, 2015

Wafer lapping ,polishing ,thinning ceramic plate

Wafer lapping ,polishing ,thinning ceramic plate
















Key Features 


· Material
   99.8% Alumina,high density,high hardness and good thermal conductitivity 

· Tolerance
   High flatness,parallelism ,roughness and micro constructure 
 
· Efficiency
   Contract manufacturing on associated variety of shapes,sizes and retain regular sizes in stock
 
· Cost   
    Total cost ownership commitment with swift responding,consistent cost reduction and overal design and development


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