Porous chuck,Polishing,grinding spare parts for Okamoto products
www.chuck-table.com
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Okamoto is a leading manufacturer of precision grinding and polishing tools since 1935. Grinding tools used in applications of wafer manufacturing, SOI, TSV, MEMS, thin wafers down to 25 um, bonded wafers, bumped wafers, solar ingot grinding, quartz, sapphire, GaAs, InP and more. Polishing tools used with CMP technology for high throughput and high accuracy. All tools available up to 300mm. For thin wafer applications, grind/polish systems can be integrated with a mounter, DAF, and detaper equipment as a complete in-line system. Okamoto is ISO9002 certified.
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The machine can grind semiconductor material such as Si, GaAs andGaP, and can grind electronic material such as ferrite and ceramic. Utilizing the Okamoto grinding method, the machine can achieve high wafer throughput without influencing machining accuracy.
 | | GNX201D300 
Dual-side wafer backgrinder with up to 300mm capability. Used by wafer manufactucturers for high-throughput and high precision dual-side grind. |
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 | | GNX200B
Fully Automatic wafer grinder with down-feed grinding method and Robotics wafer handling.
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| | GNX200BP
Fully Automatic wafer grinder with down-feed grinding method and Robotics wafer handling.
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 | | GNX300B
Fully Automatic wafer grinder with down-feed grinding method and Robotics wafer handling.
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 | | GDM300
Fully-Automatic Wafer Grinder and Dual Polish In-Line system for wafer thinning in production: 25 um capability. Integrated Edge-grinder optional. Non-contact laser thickness detection optional. Available to dock directly to Detaper/Mounter unit.
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